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  Biden-Harris Administration Launches $1.6 Billion Funding for U.S. Semiconductor Advanced Packaging

  By：EE Newsroom EE Newsroom

SoftBank To Build Japan’s Largest AI Supercomputer With NVIDIA’s Blackwell AI Chips

By：EE Newsroom

Amazon steps up effort to build AI chips that can rival Nvidia

By：EE Newsroom

Qualcomm unveils new chips for smart home gadgets

By：EE Newsroom

Renesas Entry-Line MCUs Integrate Arm Helium Technology

By：EE Newsroom

Keysight and ADI Partner to Develop GMSL Testing Methodology

By：EE Newsroom

Intel Plans to Manufacture Most of Next-Gen PC Chip Lineup Internally

By：EE Newsroom

TSMC Set to Receive ASML's Next-Gen Chip Machines This Year

By：EE Newsroom

Global Helium Shortage Affects Chip Production at TSMC and Intel

By：EE Newsroom

OpenAI Develops Proprietary AI Chips to Compete with NVIDIA's Dominance

By：EE Newsroom

South Korea’s Chip Production Declines for the First Time in Over a Year

By：EE Newsroom